发明名称 |
BOARD ADAPTED TO MOUNT AN ELECTRONIC DEVICE, SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFORE, AND PORTABLE DEVICE |
摘要 |
A board adapted to mount an electronic device includes an insulating resin layer, a wiring layer of a predetermined pattern provided on one surface of the insulating resin layer, a bump electrode provided on an insulating-resin-layer-side surface of the wiring layer, and a covering, formed of a metal layer, which covers a top surface of the bump electrode and a region, at a side surface of the bump electrode, continuous with the top surface excluding a region in contact with the wiring layer.
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申请公布号 |
US2009121350(A1) |
申请公布日期 |
2009.05.14 |
申请号 |
US20080266907 |
申请日期 |
2008.11.07 |
申请人 |
YAMAMOTO TETSUYA;OKAYAMA YOSHIO;YANASE YASUYUKI |
发明人 |
YAMAMOTO TETSUYA;OKAYAMA YOSHIO;YANASE YASUYUKI |
分类号 |
H01L23/48;H01L21/44;H01L21/768;H01L23/498 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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