发明名称 |
THERMAL CONDUCTIVE COMPOSITION |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermal conductive composition having more suitable applicability in uses of thermal conductivity from a heating element. <P>SOLUTION: A thermal conductive composition comprises an organic matrix and thermal conductive fillers. The organic matrix comprises a titanate coupling agent in the ratio of the titanate coupling agent to the total mass quantity of the organic matrix being from 3 to 100% by mass. The thermal conductive fillers comprise a thermal conductive filler of being particulate having a particle size of from 0.1 to 1 μm, and a thermal conductive filler of being particulate having a particle size over 1 μm up to 100 μm. The ratio of the thermal conductive filler of being particulate having a particle size from 0.1 to 1 μm to the total mass quantity of the thermal conductive fillers is from 1 to 50% by mass. The ratio of thermal conductive fillers to the total volume of the thermal conductive component is from 80 to 86% by volume. <P>COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2009102577(A) |
申请公布日期 |
2009.05.14 |
申请号 |
JP20070277810 |
申请日期 |
2007.10.25 |
申请人 |
POLYMATECH CO LTD |
发明人 |
TAKAHASHI KOUYA;MARUYAMA TOMOKO |
分类号 |
C08L101/00;C08K3/00;C08K5/057;C09K5/08;H01L23/36;H01L23/373;H05K7/20 |
主分类号 |
C08L101/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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