发明名称 CRYSTAL DEVICE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To easily cope with a change of IC chips and to surely protect the circuit functionality of an IC chip in a crystal device which is provided with a container body formed of laminated ceramic, a crystal piece and the IC chips obtained by integrating a circuit by using the crystal chip, and in which the crystal piece is hermetically encapsulated in a first recess formed at the container body and the IC chips are housed in a second recess. SOLUTION: An IC chip 1 is fixedly stuck to one principal plane of a mounting board 22 formed of a printed circuit board, and the mounting board 22 is bonded to the opened end face of the second recess 10b by using an anisotropic conductive resin 26 so as to accommodate an IC chip 2 in the second recess 10b of the container body 2. The opened end face of the second recess 10b is provided with a first connection terminal 5 for electrically connected to the crystal piece 3, and the one principal plane of the mounting board 22 is provided with a plurality of connection terminals 19 electrically connected to the IC chip 1 at a position corresponding to the connection terminal 5. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009105628(A) 申请公布日期 2009.05.14
申请号 JP20070275180 申请日期 2007.10.23
申请人 NIPPON DEMPA KOGYO CO LTD 发明人 HARIMA SHUSUKE
分类号 H03B5/32 主分类号 H03B5/32
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