SUBSTRATE PROCESSING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus for uniformly performing processing using a treatment liquid to the entire region of one surface and the other surface of a substrate by removing gas staying in the liquid-tight space of the treatment liquid. SOLUTION: While a wafer W is being held by a lower plate section 4, an opposing surface 9 under the substrate of the lower plate section 4 opposes the lower surface of the wafer. An upper plate 2 is arranged opposite to the wafer W. The treatment liquid is supplied to an upper treatment space 41 sandwiched between the upper surface of the wafer W and an opposing surface 19 above the substrate of the upper plate 2, thus making the upper treatment space 41 liquid-tight by the treatment liquid. The treatment liquid is supplied to a lower treatment space 42 sandwiched between the lower surface of the wafer W and the opposing surface 9 under the substrate of the lower plate section 4, thus making the lower treatment space 42 liquid-tight by the treatment liquid. The upper plate 2 and the lower plate section 4 are formed by hydrophilic quartz. COPYRIGHT: (C)2009,JPO&INPIT