| 摘要 |
The present invention relates to a preflux composition having excellent heat-resistance suited for the formation of a film on the surface of copper or copper alloy, and more precisely, a preflux composition having enhanced heat-resistance, compared with the conventional preflux composition, and capable of selectively coating a copper plating circuit. The preflux composition with high heat-resistance of the present invention is characteristically composed of 0.1-5 weight part of benzimidazole derivative, 0.5-20 weight part of organic acid or inorganic acid, 0.001-1 weight part of iron compound, 0.001-1.5 weight part of chelating agent, 0.0001-1 weight part of nickel compound and 0.01-1 weight part of iodine compound for 100 weight part of water.
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