发明名称 LEAD FRAME STRUCTURE AND APPLICATIONS THEREOF
摘要 A lead frame structure comprises a side rail, a first paddle, a second paddle, a plurality of leads, and an downset anchor bar. The first paddle is connected to the side rail via at least one first tie bar, and the second paddle is connected to the side rail via at least one-second tie bar. The first paddle and the second paddle separated from each other are used to define an area to support a chip. These leads set on the side rail expends toward to the chip supporting area. One end of the downset anchor bar is connected to the side rail, and the other end of the downset anchor bar has a protrusion portion which is between the first paddle and the second paddle and is downset from the side rail.
申请公布号 US2009121329(A1) 申请公布日期 2009.05.14
申请号 US20080167622 申请日期 2008.07.03
申请人 CHEN CHIA-YU;PONG TA-LIN;CHANG EN-SHOU;CHENG I-CHI;SU CHEN-PING 发明人 CHEN CHIA-YU;PONG TA-LIN;CHANG EN-SHOU;CHENG I-CHI;SU CHEN-PING
分类号 H01L23/495;H05K7/18 主分类号 H01L23/495
代理机构 代理人
主权项
地址