INLINE-TYPE WAFER CONVEYANCE DEVICE

摘要

An inline-type wafer conveyance device is provided with a structure where a load lock chamber (51) for bringing in/out a wafer, a first conveyance module (53a) having a first conveyance mechanism (54a), a first process module (52a), a second conveyance module (53b) having a second conveyance mechanism (54b) and a second process module (52b) are sequentially connected in series. The wafer (55) is conveyed between the load lock chamber and the first process module by the first conveyance mechanism, and is conveyed between the first process module and the second process module by the second conveyance mechanism.