| 摘要 |
<p>Provided is a wire saw apparatus comprising a wire made to run on a plurality of grooved rollers for running reciprocally in an axial direction, a nozzle for feeding slurry, and a work feeding mechanism for feeding a work to the wire while holding it. The wire saw apparatus feeds the work by pushing it onto the reciprocally running wire while feeding the wire with the slurry from the nozzle, thereby to cut the work into a wafer shape. In the wire saw apparatus, a work holding portion of the work feeding mechanism holds the work through an application plate adhered to the work and a work plate, and plate- or block-shaped slurry splash preventing members for preventing the slurry from splashing from the wire cut-in portion of the work are arranged in the direction orthogonal to the wire lines below the work holding portion and on the two wire cut-in and cut-out sides. Thus, the wire saw apparatus can suppress the wok from meandering, as might otherwise be caused by the slurry splashed from the wire cut-in portion of the work, so that the wafer to be cut can be improved in the warp.</p> |
