Fotoempfindliche Kunststoffzusammensetzung, Verfahren zur Herstellung von Reliefmustern, und elektronische Bauteile

摘要

A photosensitive polymer composition, having (a) a polymer selected from polyimide precursors and polyimides having an acid group protected by a protecting group and having no amino group (-NH2) at the end; and (b) a compound that generates an acid when exposed to light and capable of deprotecting the protecting group from the acid group, is employed to form layers of a semiconductor device.