| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a gold alloy wire excellent in roundness of a compression bonding ball shape although the gold alloy wire excels in a molten ball formation property, a stitch junction property and wire strength, and responding to high-density wiring of a semiconductor apparatus. <P>SOLUTION: This gold alloy wire for ball bonding is formed of a gold alloy including 10-50 mass ppm of magnesium (Mg), 5-20 mass ppm of europium (Eu), 2-9 mass ppm of calcium (Ca) and 99.995 mass% or more of gold (Au) as the residual part, wherein calcium (Ca) has mass not larger than half of that of europium (Eu). <P>COPYRIGHT: (C)2009,JPO&INPIT |
