发明名称 SOLDER PASTE, ELECTRIC BOARD, AND METHOD OF MANUFACTURING ELECTRIC BOARD
摘要 PROBLEM TO BE SOLVED: To provide solder paste and electric boards capable of suppressing abnormal electrical short-circuiting of adjoining conductive points and a method of manufacturing electric boards. SOLUTION: Adjoining conductive points are assumed to be electrically short-circuited when they are positioned very closely and the application range of solder paste 10 is not constant. However, by gathering magnetic material powder 16 made by coating a magnetic part 16A with an insulating layer 16B among adjoining conductive points by magnetic force, electrical short-circuiting of adjoining conductive points 34 can be suppressed by the insulating layers 16B of the magnetic material powder 16 even when the conductive points 34 are positioned very closely. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009104883(A) 申请公布日期 2009.05.14
申请号 JP20070275160 申请日期 2007.10.23
申请人 FUJIFILM CORP 发明人 SHIMIZU TOMIO
分类号 H01B1/22;H01B1/00;H01L21/60;H01R11/01;H05K3/34 主分类号 H01B1/22
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