| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder printing apparatus can stabilizing the thickness of a solder fed to a substrate even when a squeegee is deteriorated or the like, and to provide a mounting substrate manufacturing method. SOLUTION: The solder printing apparatus 1 is equipped with the substrate 61, a mask 3 equipped with an opening part 3a for printing and overlapped on the substrate 61, a creamy solder 62 fed to the mask 3, a squeegee 4 sliding on the mask 3 to fill the solder 62 into the opening part 3a for printing, and an air cylinder 7 for pressing the squeegee 4 to the mask 3. In the solder printing apparatus 1, the mask 3 has an opening 3b for detection on a slide starting position side where the squeegee 4 starts sliding from the opening part 3a for printing, and has a displacement meter 8 for measuring the amount of distortion which is generated by bending of the squeegee 4 at the opening part 3b for detection, and a controlling apparatus 9 for controlling a printing load by which the air cylinder 7 presses the squeegee 4 to the mask 3 so as to make the amount of distortion of the squeegee 4 to be a set value from a measurement result of the displacement meter 8. COPYRIGHT: (C)2009,JPO&INPIT
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