| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain electronic equipment capable of improving cooling performance. <P>SOLUTION: The electronic equipment 1 includes first and second heating elements 21, 22 mounted on a circuit board 14. A first heat pipe 31 includes a first edge 31a thermally connected to the first heating element 21 and a second edge 31b thermally connected to a heat radiating section 15. A second heat pipe 32 includes: a first edge 32a thermally connected to the second heating element 22; a second edge 32b thermally connected to the heat radiating section 15, and a middle section 32c extended to a region opposite to the first heating element 21. A heat conductive member 41 has flexibility and is provided between the middle section 32c of the second heat pipe 32 and the first heating element 31 and thermally connects the middle section 32c of the second heat pipe 32 to the first heating element 31. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
