WIRING BOARD AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a wiring board capable of making smaller the connection pad pitch in the wiring board for flip-chip packaging wherein solder is provided on the connection pads.

SOLUTION: The wiring board comprises a structure where a plurality of the connection pads 22 and leading-out wiring portions 24 each connected to the connection pads 22 are arranged on an insulating layer 30 on the surface layer side, the leading-out wiring portions 24 being bent and arranged from the connection pads 22, and projecting solder layers 42 are provided on the connection pads 22. The solder layers 42 projected on the connection pads 22 are formed so that the solder on the leader wiring portions 24 moves to the bent portions B side.

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