SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of highly rigid junction between electrodes and cost reduction.

SOLUTION: The semiconductor device includes: a first semiconductor chip 10; a first electrode 12 provided on the chip 10; a second semiconductor chip 20 on which the first semiconductor chip 10 is mounted; a second electrode 22 provided on the second semiconductor chip 20 and having a protrusion 24; and a solder bump 14 for joining the first electrode 12 with the second electrode 22 and covering at least part of a side face of the protrusion 24. Moreover, the manufacturing method is also provided.

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