发明名称 LEAD FRAME
摘要 PROBLEM TO BE SOLVED: To provide a lead frame low in material cost. SOLUTION: By using inexpensive paper or plastic for a part of a frame 2 of this lead frame 1 instead of using a metal material, metal material is used only for a part mostly used in a product, and the cost of the metal material for use is reduced. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009105169(A) 申请公布日期 2009.05.14
申请号 JP20070274541 申请日期 2007.10.23
申请人 NEC TOKIN CORP 发明人 YAMAUCHI HIDEAKI
分类号 H01L23/50 主分类号 H01L23/50
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