发明名称 METHOD FOR FABRICATING A CONDUCTIVE PLUG
摘要 A method for fabricating a conductive plug includes the steps of providing a substrate having at least a gate structure thereon, a first dielectric layer covering a surface of the substrate, a second dielectric layer disposed on the first dielectric layer, and at least a metal line formed within the second dielectric layer; forming a hard mask plug on the second dielectric layer; forming a third dielectric layer covering the second dielectric layer and the hard mask plug; removing a portion of the third dielectric layer to expose the hard mask plug; removing the hard mask plug to form a plug hole; and forming the conductive plug within the plug hole to electrically connect with the gate structure.
申请公布号 US2009124079(A1) 申请公布日期 2009.05.14
申请号 US20080042347 申请日期 2008.03.05
申请人 HUANG JEN-JUI;LIN CHIH-CHING;CHEN KUO-CHUNG 发明人 HUANG JEN-JUI;LIN CHIH-CHING;CHEN KUO-CHUNG
分类号 H01L21/768 主分类号 H01L21/768
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