| 摘要 |
A method of manufacturing a semiconductor package, including at least a step A that forms a first and second transforming portions (24,25) by irradiating a laser beam (L) on at least a portion of a first substrate (20); a step B that joins together the first substrate (20) and a second substrate (10) in which a functional element (11) is disposed; a step C that removes the first (and second) transforming portion(s) (24,25) that is disposed on the first substrate (20) by etching; and a step D that forms a conductive portion (21) in the first substrate (20) by filling a conductive material (23) in a portion (22) where the first transforming portion (24) has been removed. |
