发明名称 Molding material transfer method and substrate structure
摘要 The present invention provides a new and highly reliable substrate manufacturing technology for manufacturing a substrate with a protrusion pattern, which can decrease structural defects caused by involving bubbles when the protrusion pattern is formed, can improve the reliability of the product and the yield of the product, does not require off-line steps such as vacuum deaeration, and therefore improves the production efficiency and simplifies the steps. According to the present invention, a molding material paste is filled into the concave portions of an intaglio plate for filling, an intaglio plate for transfer on which a specific groove pattern is formed is partially contacted with the intaglio plate for filling, the molding material is filled into the grooves of the intaglio plate for transfer, then the molding material is transferred from the intaglio plate for transfer to a substrate as a protrusion pattern.
申请公布号 US7530305(B2) 申请公布日期 2009.05.12
申请号 US20050174459 申请日期 2005.07.06
申请人 HITACHI LIMITED 发明人 TOYODA OSAMU;INOUE KAZUNORI;TOKAI AKIRA
分类号 B41M1/10;B41F17/14;H01J9/02;H01J11/12;H01J11/22;H01J11/24;H01J11/26;H01J11/34;H01J11/36 主分类号 B41M1/10
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