发明名称 |
Heat sink made from diamond-copper composite material containing boron, and method of producing a heat sink |
摘要 |
A heat sink that is particularly suitable for semiconductor components is made from a diamond-containing composite material. In addition to a diamond fraction amounting to 40-90% by volume, the composite material also contains 7 to 59% by volume copper or a copper-rich phase (with Cu>80 at. %) and 0.01 to 20% by volume boron or a boron-rich phase (with B>50 at. %). The bonding of copper to the diamond grains can be considerably improved by the addition of boron, with the result that a high thermal conductivity can be achieved. The heat sink component is preferably produced with an unpressurized and pressure-assisted infiltration technique.
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申请公布号 |
US7531020(B2) |
申请公布日期 |
2009.05.12 |
申请号 |
US20050590613 |
申请日期 |
2005.04.13 |
申请人 |
PLANSEE SE;ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE |
发明人 |
WEBER LUDGER |
分类号 |
C22C1/10;C22C26/00;H01L23/373 |
主分类号 |
C22C1/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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