| 摘要 |
Provided is a light emission diode package and a fabricating method thereof. The light emission diode package includes a heat sink having a groove, a printed circuit board on the heat sink, a light emission diode on the groove, a reflector coupled to the heat sink, a lead frame included in the reflector and electrically connecting the light emission diode to the printed circuit board and a molding unit on the light emission diode.
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