发明名称 |
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ARRAY OF EXTERNAL INTERCONNECTS |
摘要 |
An integrated circuit package system includes: forming an array of external interconnects with an intersecting region between the external interconnects; removing the intersecting region for forming an isolation hole between the external interconnects; mounting an integrated circuit die over the external interconnects; connecting an internal interconnect between the integrated circuit die and the external interconnects; and forming a package encapsulation over the integrated circuit die with the external interconnects partially exposed. |
申请公布号 |
KR20090047380(A) |
申请公布日期 |
2009.05.12 |
申请号 |
KR20080110680 |
申请日期 |
2008.11.07 |
申请人 |
STATS CHIPPAC LTD. |
发明人 |
CAMACHO ZIGMUND RAMIREZ;BATHAN HENRY DESCALZO;ADVINCULA ABELARDO JR. HADAP;TAY LIONEL CHIEN HUI |
分类号 |
H01L23/48;H01L21/60;H01L23/28 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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