PHOTOSENSITIVE RESIN COMPOSITION, AND FLEXIBLE PRINTED WIRING CIRCUIT BOARD HAVING COVER INSULATING LAYER OBTAINED BY USING SAME

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition of a flexible printed wiring circuit board with no tack or few tack.

SOLUTION: The photosensitive resin composition contains the following (A)-(D): (A) a carboxyl group-containing linear polymer obtained by addition polymerization of an ethylenic unsaturated compound containing a structural unit of specific hydroxyethyl (meta) acrylate derivative at a ratio of 5-50 wt.% with respect to the entire polymer; (B) an epoxy resin; (C) an ethylenic unsaturated group-containing polymerizable compound; and (D) a photopolymerization initiator.

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