发明名称 FILM DEPOSITION APPARATUS AND FILM DEPOSITION METHOD
摘要 PROBLEM TO BE SOLVED: To stably perform a film deposition operation for a long time at a high deposition rate so as to increase productivity of organic EL displays, and to achieve a uniform film thickness distribution. SOLUTION: A film deposition apparatus deposits a sublimed or evaporated deposition material on a substrate W in a deposition chamber. In the apparatus, a linkage space 14 is disposed between a plurality of material-containing parts 10 equipped with heating units 11 and discharge outlets 13 for discharging the deposition material toward the substrate W. A high deposition rate can be achieved by using the plurality of material-containing parts 10. The deposition materials sublimed or evaporated from the individual material-containing parts 10 are mixed in the linkage space 14 and discharged toward the substrate W from the plurality of discharge outlets 13 as vapor, which realizes a uniform film thickness distribution. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009097044(A) 申请公布日期 2009.05.07
申请号 JP20070270867 申请日期 2007.10.18
申请人 CANON INC 发明人 UKIGAYA NOBUTAKA;SODA TAKEHIKO;KONUMA KYOEI;KURAMOCHI KIYOSHI;SUSHIGEN TOMOKAZU;NAKANE NAOHIRO
分类号 C23C14/24;C23C14/12;H01L51/50;H05B33/10 主分类号 C23C14/24
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