发明名称 |
IMAGER DIE PACKAGE AND METHODS OF PACKAGING AN IMAGER DIE ON A TEMPORARY CARRIER |
摘要 |
<p>Methods for fabricating an imager die package and resulting die packages are disclosed. An imager die packaging process may include dicing through a fabrication substrate comprising a plurality of imager die. Thereafter, known good die (KGD) qualified from the imager die are repopulated, face down on a high temperature-compatible temporary carrier, the KGD on the temporary carrier are encapsulated and thereafter removed as a reconstructed wafer from the temporary carrier. Furthermore, a first plurality of discrete conductive elements on a back side of the reconstructed wafer may be partially exposed and, optionally, a second plurality of discrete conductive elements may be applied to the first plurality of discrete conductive elements. The encapsulated KGD are then singulated.</p> |
申请公布号 |
WO2009035858(A3) |
申请公布日期 |
2009.05.07 |
申请号 |
WO2008US74594 |
申请日期 |
2008.08.28 |
申请人 |
MICRON TECHNOLOGY, INC.;OLIVER, STEVEN;FARNWORTH, WARREN, M. |
发明人 |
OLIVER, STEVEN;FARNWORTH, WARREN, M. |
分类号 |
H01L27/148 |
主分类号 |
H01L27/148 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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