| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame and manufacturing method thereof, and a resin-sealed semiconductor device and manufacturing method thereof, with and by which the reliable lead frame is stably supplied that can prevent delamination due to a difference in coefficient of thermal expansion, does not impair bonding properties. SOLUTION: Provided is the lead frame which has a die pad mounted with a semiconductor element, an outer lead for connection with an external circuit, an inner lead extended to the outer lead to be connected to a connection pad on the semiconductor element, the lead frame being characterized in that a sectional shape of the lead frame is rounded. COPYRIGHT: (C)2009,JPO&INPIT |
