CIRCUIT CONNECTING METHOD

摘要

A circuit connecting method with which connection resistance between circuit electrodes which are electrically connected through an anisotropic conductive film for circuit connection can sufficiently be reduced is provided. The circuit connecting method is provided with a process for preparing a circuit member (12) where a circuit electrode (12b) is formed on a glass substrate (12a), a process for preparing a flexible wiring board (14) where a circuit electrode (14b) is formed on a base material (14a) and solder resist (18) is arranged in a part except for a part connected to the circuit electrode (12b) in the circuit electrode (14b) and a process for bonding the circuit member (12) and the flexible wiring board (14) through the anisotropic conductive film for circuit connection (16) so that a part of the anisotropic conductive film for circuit connection (16) is overlapped with a part of solder resist (18). Thickness (h3) of the anisotropic conductive film for circuit connection (16) is not more than a total of height (h1) of the circuit electrode (12b) and height (h2) of the circuit electrode (14b).