Cooling device for cooling semiconductor chip of commercial personal computer, has heat conductive material e.g. gap filler, arranged between heat absorption surface and coupling surface of heat spreading element

摘要

The device (1) has a semiconductor chip (3) and cooling element (7) connected with a carrier element (2) and comprising a heat emission surface (11) and heat absorption surface (12), respectively. The surfaces lie opposite to each other, where the surface (12) is larger than the surface (11). A rigid heat spreading element (5) is arranged between the surfaces and has two coupling surfaces (13, 14) lying opposite to the surfaces (11, 12), respectively. A heat conductive material e.g. gap filler, (6) arranged between the surfaces (12, 14), establishes a connection between the surfaces (12, 14).