发明名称 |
MOLD CLEANING RUBBER COMPOSITON |
摘要 |
<p>This invention provides a mold cleaning rubber composition for removing soiling on the surface of a mold produced in a curable resin molding process. An unvulcanized rubber is used as a base material resin. The unvulcanied rubber comprises an ethylene-propylene rubber and a butadiene rubber at a mixing ratio of 90/10 to 50/50 on the basis of parts by weight. After the vulcanization curing of the unvulcanized rubber, the elongation is 80 to 800%, the tensile strength is 3 to 10 MPa, and the rubber hardness (durometer hardness) is A60 to 95. The 90% vulcanization time (proper vulcanization point) tc (90) at a mold temperature of 175°C is 50 to 100 sec or 200 to 400 sec. When the mold cleaning rubber composition is used for cleaning for molds for the production of small-size packages having a large cavity depth, for example, PDIP or SOIC, and molds for the production of small packages, particularly small packages with a small number of pins, preferably, the mold cleaning rubber composition contains a release agent in addition to the unvulcanized rubber having a tc (90) value of 200 to 400 sec.</p> |
申请公布号 |
WO2009057479(A1) |
申请公布日期 |
2009.05.07 |
申请号 |
WO2008JP69029 |
申请日期 |
2008.10.21 |
申请人 |
NIPPON CARBIDE KOGYO KABUSHIKI KAISHA;NOMURA, HIROAKI;HIROMITSU, KIYOHITO;SUNAGO, OSAMU |
发明人 |
NOMURA, HIROAKI;HIROMITSU, KIYOHITO;SUNAGO, OSAMU |
分类号 |
B29C33/72;C08L9/00;C08L23/16;C11D3/37 |
主分类号 |
B29C33/72 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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