| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminated semiconductor package for preventing the damage of a semiconductor chip during a wire bonding process, and to provide a manufacturing method thereof. <P>SOLUTION: The laminated semiconductor package includes: a substrate 10 including a first connection pad 12 and a second connection pad 14; a first laminated package group 20 disposed on the substrate 10, for which first semiconductor chips 21-24 are laminated in a step form; a first conductive wire 30 for electrically connecting a first edge bonding pad and the first connection pad 12; an adhesion member 25 disposed on the first upper semiconductor chip 24 disposed at the upper part of the first laminated package group 20; a second laminated package group 50 disposed on the adhesion member 25 and including second semiconductor chips 51-54 laminated in the step form; and a second conductive wire 60 for electrically connecting a second edge bonding pad and the second connection pad 14. <P>COPYRIGHT: (C)2009,JPO&INPIT |
