| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board with a shield for which the connection configuration of a shield terminal wiring layer provided in the inner layer part of a multilayer wiring board and a shield layer covering an outer layer part is improved especially. SOLUTION: The circuit board with the shield includes: one wiring board material 1 for which a wiring layer 1b is formed on the surface of an insulating substrate 1a corresponding to a circuit function part X and a cable part Y adjacent to each other; an inner layer wiring board material 2 laminated on the surface of the one wiring board material 1 corresponding to the circuit function part, for which a signal wiring layer 2b and a shield terminal layer 2c are formed on the surface of the insulating substrate; an outer layer wiring board material 3 laminated on the inner layer board material, for which a wiring layer is formed on the surface of the insulating substrate; a shield layer SHa provided covering at least the circuit function part; and inter-layer conductive vias 1V-5V provided on the respective wiring base materials. The respective sidewall parts of the inner/outer layer wiring board materials are mutually in a step shape at the interface of the circuit function part and the cable part, the shield terminal layer is exposed to the upper surface of the step, and the shield layer is connected to the exposed surface. COPYRIGHT: (C)2009,JPO&INPIT |
