| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an improved method for cutting a chip package into individual pieces. <P>SOLUTION: The method for cutting the chip package 100 combined in one group and containing a plastic molded body 104 into the individual pieces by separating them along a target separation area includes: a process of at least partially removing a lead frame 107 extending inside a target separation area by laser engraving; and a process of completely separating the chip package 100 by mechanical sawing along the target separation area subsequently. By the processes, in the target separation area, the lead frame 107 lining with a plastic layer formed of the material of the molded body 104 and extending over at least the partial length of the target separation area is cut. <P>COPYRIGHT: (C)2009,JPO&INPIT |
