发明名称 FLUID EJECTION ASSEMBLY
摘要 PROBLEM TO BE SOLVED: To provide a fluid ejection assembly capable of surely forming an image of high quality at minimum cost. SOLUTION: The fluid ejection assembly has an ejection head carrier 72; a rigid substrate 62 formed to the outline of the ejection head carrier to be fixedly positioned relative to the ejection head carrier; a conductive pattern 64 defined on the rigid substrate and configured to transmit an electric signal to an ejection head 70; and an overmolding configured to cover at least a part of the conductive pattern by creating a substantially fluid-tight seal that limits the exposure of a part of the conductive pattern to a degenerative substance. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009096209(A) 申请公布日期 2009.05.07
申请号 JP20080314529 申请日期 2008.12.10
申请人 HEWLETT-PACKARD DEVELOPMENT CO LP 发明人 VITELLO CHRISTOPHER;CHOY SILAM J;LAMBRIGHT TERRY M;TUCKER MARK D
分类号 B41J2/045;B41J2/05;B05C5/00;B41J2/055;B41J2/16;B41J2/175 主分类号 B41J2/045
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