发明名称 |
FLUID EJECTION ASSEMBLY |
摘要 |
PROBLEM TO BE SOLVED: To provide a fluid ejection assembly capable of surely forming an image of high quality at minimum cost. SOLUTION: The fluid ejection assembly has an ejection head carrier 72; a rigid substrate 62 formed to the outline of the ejection head carrier to be fixedly positioned relative to the ejection head carrier; a conductive pattern 64 defined on the rigid substrate and configured to transmit an electric signal to an ejection head 70; and an overmolding configured to cover at least a part of the conductive pattern by creating a substantially fluid-tight seal that limits the exposure of a part of the conductive pattern to a degenerative substance. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009096209(A) |
申请公布日期 |
2009.05.07 |
申请号 |
JP20080314529 |
申请日期 |
2008.12.10 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT CO LP |
发明人 |
VITELLO CHRISTOPHER;CHOY SILAM J;LAMBRIGHT TERRY M;TUCKER MARK D |
分类号 |
B41J2/045;B41J2/05;B05C5/00;B41J2/055;B41J2/16;B41J2/175 |
主分类号 |
B41J2/045 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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