HIGH DENSITY IC MODULE

摘要

A system and method for assembling dual-die integrated circuit packages using thermocompression bonding or thermosonic bonding to bond a second die (8) to a substrate (4) opposite a first die (6) bonded to the substrate (4). The second die (8) is bonded using heat conducted through the first die (6) to the substrate (4), and optionally through an underfill material. The first (6) and second (8) die are connected such that bumps (10) are connected to common bonding pads (12) on the substrate (4). Bumps (10) on one of the die extend through openings in the substrate (4) to connect to the common bonding pads (12). The bonding pads (12) are within the perimeter of the first die (6).