| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve high-density wiring and fine pitch without arranging an electrically-plated conductor, to improve a bonding property to a gold wire of wire bonding junction, and to respond to usage of a high pin number of a fine pitch. <P>SOLUTION: A package board includes: two facing chip arrangement side and solder ball arrangement side; a plurality of wire bonding pads 401 and a plurality of solder ball pads 402 on the respective sides; and a first insulation protective layer and a second insulation protective layer on the chip arrangement side and the solder ball arrangement side, respectively. The package board includes: a board body on which a plurality of first openings and a plurality of second openings for exposing the wire bonding pads and the solder ball pads are opened on the first and second insulation protective layers, respectively; chemically-plated metal layers 42 formed on the surfaces of the wire bonding pads and the solder ball pads; and a wire bonding metal layer 45 formed on the surface of the chemically-plated metal layer 42 on the wire bonding pads. <P>COPYRIGHT: (C)2009,JPO&INPIT |
