SOLID-STATE IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a small and low cost solid-state image sensor having a back electrode structure and capable of a uniform display by solving the backside light incidence problem.

SOLUTION: The solid-state image sensor includes: an image sensor substrate in which an image sensor portion is formed on a first main surface side; backside wiring electrodes provided on a second main surface side of the image sensor substrate which is the side opposite to the first main surface side and electrically connected to the image sensor portion; a circuit board provided with circuit board electrodes and opposed to the second main surface; a connection portion for electrically connecting the backside wiring electrodes and the circuit board electrodes together; and a light-shielding layer provided on the same surface as the backside wiring electrodes or on the circuit board side as seen from the backside electrodes. The method of manufacturing the solid-state image sensor is characterized in that the surface treatment for making at least part of the backside wiring electrodes hydrophobic is carried out, and a light-shielding layer is provided on the second main surface except that part.

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