| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a core substrate comprising a core having conductivity which prevents an electric short circuit between a conduction through-hole and the core, and can be suitably used for manufacturing a wiring substrate on which wiring is formed with high density, and its manufacturing method. <P>SOLUTION: A core substrate comprises a core 10 having conductivity in which a lower opening 18 through which a conduction through-hole 52 penetrates is formed, wiring layers 48 laminated and formed on both surfaces of the core 10, a plating layer 19 adhered to and formed on the inner wall surface of the lower opening 18, and an insulating material 20 which is filled in a portion between the plating layer 19 and the periphery surface of the conduction through-hole 52. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
