发明名称 SEMICONDUCTOR INSPECTION DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor inspection device capable of preventing displacement of a wafer. SOLUTION: The semiconductor inspection device includes: a wafer holder 3 having a vacuum chuck for fixing a semiconductor wafer 6 thereto; a card substrate 2 arranged opposite to the wafer holder 3 and provided with probes 4; spacers 5 arranged to surround the semiconductor wafer 6 and the probes 4 between the wafer holder 3 and the card substrate 2 so as to form a sealed space 7 between the wafer holder 3 and the card substrate 2; and a pressure reducing device for reducing the pressure of the sealed space 7 to suck the wafer 6 by the vacuum chuck. The semiconductor inspection device further includes a control means for controlling the pressure reducing device to keep the pressure of the sealed space 7 in a state lower than the atmospheric pressure and higher than the pressure of the vacuum chuck. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009099630(A) 申请公布日期 2009.05.07
申请号 JP20070267260 申请日期 2007.10.12
申请人 JAPAN ELECTRONIC MATERIALS CORP 发明人 MORI CHIKAOMI
分类号 H01L21/66;G01R31/28;H01L21/683 主分类号 H01L21/66
代理机构 代理人
主权项
地址