| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board, which can reduce a diameter of each opening, in a method of manufacturing a wiring board provided with: insulating layers covering pads; openings formed on the insulating layers by laser beams and exposing partial parts of the pads; and vias formed on the openings and connected to the pads. SOLUTION: Insulating layer formation members each provided with a support film 74, and an insulating layer arranged on one-side surface 74A of the support film 74, and brought into a half-hardened state are prepared; then, the insulating layer formation members are stuck to pads 23 and 37 so that the pads 23 and 37 come into contact with the insulating layers each brought into the half-hardened state; then, insulating layers 24 and 38 are formed by hardening the insulating layers each brought into the half-hardened state; and thereafter, openings 51 and 61 are formed on the insulating layers 24 and 38 by irradiating the insulating layers 24 and 38 with laser beams 271 through the support films 74. COPYRIGHT: (C)2009,JPO&INPIT |
