发明名称 METHOD FOR MANUFACTURING THIN SUBSTRATE USING A LAMINATE BODY
摘要 Provided is a laminated body comprising a substrate to be ground and a support, where the substrate may be ground to a very small (thin) thickness and can then be separated from the support without damaging the substrate. One embodiment is a laminated body comprising a substrate to be ground, a curable silicone adhesive layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the adhesive layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.
申请公布号 US2009115075(A1) 申请公布日期 2009.05.07
申请号 US20080336994 申请日期 2008.12.17
申请人 KESSEL CARL R;BOARDMAN LARRY D;WEBB RICHARD J 发明人 KESSEL CARL R.;BOARDMAN LARRY D.;WEBB RICHARD J.
分类号 H01L21/302;B32B9/04;H01L23/28 主分类号 H01L21/302
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