COOLING DEVICE FOR ELECTRONIC EQUIPMENT CASE

摘要

An exemplary embodiment comprises three fans (V4, V5, V6) respectively associated with three compression chambers (CH2; CH3; CH4) which are separated from one another by walls (P5, P6) suitable for maintaining a pressure difference. One of the fans (V5) generates in the chamber (CH3) associated with this fan a higher pressure than that generated by the other fans (V4, V6) in the other chambers (CH2, CH4), in order to create air flows (F17, ..., F20) having a higher flow rate, and that are designed to cool circuit boards (C16, C17, C18) having a dissipation that is higher than the other boards (C12, ..., C15, C19, ..., C22).