Hitzehärtende Zusammensetzung geeignet zum Verkleben von beschichteten Substraten

摘要

Heat-curing compositions (HCC) comprising (A) epoxy resin(s) with more than 1 epoxide group per molecule, (B) impact modifier(s) and (D) heat-activated hardener(s), also contain (C) crack promoter(s). Independent claims are also included for (1) a method (M1) for glueing together heat-stable materials by contacting the surfaces of these materials with HCC and then hardening the HCC (2) a method (M2) for glueing similar or different substrates S1 and S2 together by applying HCC to S1 and/or S2, bringing S1 and S2 together and heating the HCC at 100-220 (preferably 120-200) [deg]C (3) glued articles made by these methods .