发明名称 METHOD FOR FORMING A MULTI-LAYER ELECTRODE UNDERLYING A PIEZOELECTRIC LAYER AND RELATED STRUCTURE
摘要 <p>According to an exemplary embodiment, a method of forming a multi-layer electrode for growing a piezoelectric layer thereon includes a step of forming a high conductivity metal layer over a substrate. The method further includes a step of forming a seed layer over the high conductivity metal layer. The method further includes a step of forming a high density metal layer over the seed layer. The method further includes a step of forming a piezoelectric layer over the high density metal layer. The high conductivity metal layer, the seed layer, and the high density metal layer form the multi-layer electrode on which the piezoelectric layer is grown.</p>
申请公布号 WO2009023100(A3) 申请公布日期 2009.05.07
申请号 WO2008US09320 申请日期 2008.08.01
申请人 SKYWORKS SOLUTIONS, INC.;BARBER, BRADLEY, P.;CARPENTER, CRAIG, E.;GEHLERT, PAUL, P.;SHEPARD, CHRISTOPHER, F. 发明人 BARBER, BRADLEY, P.;CARPENTER, CRAIG, E.;GEHLERT, PAUL, P.;SHEPARD, CHRISTOPHER, F.
分类号 H03H9/24;H03H9/25;H03H9/64 主分类号 H03H9/24
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