FLIP CHIP PACKAGE AND METHOD OF FABRICATING THE SAME,申请号KR20070109774-传众专利搜索

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发明名称	FLIP CHIP PACKAGE AND METHOD OF FABRICATING THE SAME
摘要
申请公布号	KR20090043946(A)	申请公布日期	2009.05.07
申请号	KR20070109774	申请日期	2007.10.30
申请人	HYNIX SEMICONDUCTOR INC.	发明人	KIM, KI YOUNG
分类号	H01L21/60;H01L23/12	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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