| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve productivity by shortening the total length of a device and shortening the time required for transferring a substrate between processes, in component mounting for mounting a component at an edge portion of the substrate. <P>SOLUTION: The component mounting device includes first and second substrate holding stages, a bonding member arranging head for arranging a bonding member at the edge portion of the substrate held on the first substrate holding stage, a component arranging head for arranging a component, via the bonding member, over the substrate held on the second substrate holding stage, a first substrate transfer device for transferring the substrate to the first substrate holding stage, a second substrate transfer device for transferring the substrate from the first substrate holding stage to the second substrate holding stage, and a linear moving device which has one common linear moving axis supporting at least first and second substrate transfer stages to independently move the first and second substrate transfer stages along the linear moving axis. <P>COPYRIGHT: (C)2009,JPO&INPIT |
