摘要 |
PROBLEM TO BE SOLVED: To reduce an influence on an electronic component by vapor, reflecting light and the like when lead terminals extending substantially in parallel with the opposing upper and bottom surfaces of the electronic component package, and conductor terminals are superposed and welded. SOLUTION: The lead terminals 4 of the electronic components 2 are bent twice nearly orthogonally, respectively, on the way in the longitudinal direction; welding parts 6 are formed on a position higher than the upper surface 3a of the package 3; and a laser 7 is irradiated to the welding parts 6 from a position nearer to the welding part 6 than the upper surface 3a of the package 3 and higher than the upper surface 3a of the package 3 and the welding part 6. Thereby, vapor, reflecting light and the like in laser welding little affects the electronic component 2, thus preventing melting and cracking of the package 3, suppressing the deterioration of the insulation and durability, and providing a highly reliable electronic circuit device. COPYRIGHT: (C)2009,JPO&INPIT
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