发明名称 METHOD FOR MANUFACTURING THIN FILM PROBE
摘要 PROBLEM TO BE SOLVED: To provide an inspection apparatus for inspecting semiconductor elements at narrow pitches with a stable contact property and a satisfactory assembling property. SOLUTION: The present invention relates to: a probe card using a probe sheet 6, lined with a metal sheet, which has a first contact terminal 4 that makes electrical contact with electrodes of objects for inspection formed at narrow pitches, a wire extending from the first contact terminal, and a second contact terminal 5 that makes electrical contact with the wire, both of the contact terminals being formed with use of etching holes of crystalline members; and a method for inspecting (method for manufacturing) semiconductor devices with use of the probe card. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009098153(A) 申请公布日期 2009.05.07
申请号 JP20080311714 申请日期 2008.12.08
申请人 HITACHI LTD 发明人 KASUKABE SUSUMU;YAMAMOTO TAKESHI
分类号 G01R1/073;G01R31/28;H01L21/66 主分类号 G01R1/073
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