ADDITIVE REMOVAL METHOD, ADDITIVE REMOVAL DEVICE, AND PLATING SYSTEM

摘要

Disclosed is a plating system comprising a plating layer-forming unit for forming a plating layer on a resin film (9) by immersing the resin film (9) in a plating solution containing a template agent, and a removal device (4) for removing the template agent from the plating layer on the resin film (9). The removal device (4) has a remover solution bath (41) holding a remover solution (411) into which the resin film (9) is immersed, and a light irradiation unit (42) for irradiating light to the resin film (9) in the remover solution (411). In the removal device (4), removal of the template agent from the plating layer is accelerated by light irradiation from the light irradiation unit (42), thereby efficiently removing the template agent from the plating layer.