| 摘要 |
<p>A system (10) and method for removing heat, in particular for removing heat from a multi-chip (40) module or integrated circuit. The system (10) is a closed system and includes a sealed container (12), and an evaporator (14), housed within the sealed container (12). The evaporator (14) is in thermal communication with a heat source, and includes an evaporator inlet (18), a plurality of evaporator outlet ports (22) and a plurality of tubes (20), each tube (20) connecting the evaporator inlet (18) with a tube outlet (22), each tube (20) containing at least one substance. The system (10) further includes a condenser (16), also housed within the sealed container (12), having a plurality of condenser inlet ports (26), a condenser outlet (30) and closed condenser channels (28) connecting the condenser inlet ports (26) with the condenser outlet (30). The system further includes a conduit (32) joining the condenser outlet (30) to the evaporator inlet (18).</p> |
