| 摘要 |
Embodiments relate to a chemical mechanical polishing (CMP) pad. According to embodiments, a CMP pad may include a pad body having a series of concave and convex patterns and a chemical reactant formed on and/or over the pad body. The CMP pad may uniformly perform a CMP process without using abrasive grains. Accordingly, scratches on a surface of a wafer may be prevented.
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